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YES manufactures precision Cleaning, Coating and Curing, as well as Wet Process equipment for innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging.* CLEAN:Three series of YES Clean Systems for gentle surface cleaning, decontamination, surface activation, descum and photoresist strip using downstream plasma.* COAT:Surface modification at the nanoscale by applying monolayer coatings to induce hydrophobic or hydrophilic properties. Variety of substrates and 100+ Silane precursors.* CURE:Polyimide, BCB or PBO cure as well as Vacuum anneal up to 400°C using thermal and chemical processes.* BOND:Low-temp direct bonding and high-temp vacuum annealing.* REFLOW:Advanced packaging reflow applications, like Fluxless Formic Acid Reflow.* WET PROCESS:Flexible, configurable, automated and manual wet process platforms for wafers and panels.