About UniTemp

The company UniTemp was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 150 K/sec up to 1200°C) and its working size (up to 300mm wafer size). Besides these ovens UniTemp is a specialist for reflow solder systems (RSS and VSS series) with a wide variety of options and accessories. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-300-U.