World leading supplier of Flip-Chip Bonders excelling in high-end applications.

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Based in France, we are a world leading supplier of Flip-Chip Bonders excelling in high-end, demanding applications. Since 1975, we have accompanied laboratories and industries, which look for a high precision and an important reliability in the assembly of their components. We accelerate their developments of the chips of future thanks to our robust and precise Flip-Chip Bonders. With Flip-Chip Bonders installed worldwide, we are globally renowned for the high post-bond sub-micron accuracy and the high flexibility of our equipment. Ranging from manual loading version to fully automated version, our systems cover a wide range of applications and offer the unique ability to handle both fragile and small components onto substrates and wafers up to 300 mm.