About Powertip Technology

Powertip’s manufacturing capabilities comprise Surface Mount Technology (SMT), Chip-On-Board (COB), Chip-On-Glass (COG), Chip-On-Flex (COF), Tape Automated Bonding (TAB) and screen printing. Production of a typical LCD panel would require Powertip to take Mother Glass, scribe, cut, fill the cells with liquid crystal and then seal the two sandwiched glass panels. Powertip has designed an ARM based HMI control board to expedite and shorten product development lead times.Powertip’s vision is to create “Display Devices for Advancing Technology” by remaining diligent, enthusiastic and innovative when designing and developing the ideal visual and touch solution for our valued customers.