Class 3 assembly, semiconductor packaging, LTCC, batteries & feedthroughs
Component insertion; Bonding of dies on PCBs; Flip chip insertion; Component insertion under cleanroom conditions; LTCC (Low-temperature Co-fired Ceramic); HTCC (High-temperature Co-fired Ceramic)
Applications: Electronics for aviation, aerospace and defence (D); Internet of Things (IoT) (I); Medical electronics (M)
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