Precision Manufacturing Systems to create more powerful electronic systems.
Hybrid circuits on glass substrates; Hybrid modules on ceramic substrates; Laser engraving; Laser welding / cutting; PCBs; Rapid prototyping; Packaging materials; Microfluidic; Wafer level packaging; MEMS packaging technology and services, miscellaneous; Glasses; Non-PTH single- and double-sided PCBs; Accessories for PCBs, miscellaneous; LTCC (Low-temperature Co-fired Ceramic); Al2O3 substrates; Ceramic PCBs, miscellaneous; 3D-MID circuit boards; Plated through-hole PCBs; PCBs with blind and buried vias; HDI PCBs; Multilayer PCBs, miscellaneous; Flexible circuits; Flex-rigid circuits; Micro via PCBs; High frequency PCBs; PCBs, other
Applications: Automation (A); Power Electronics and Energy Technology (PE)
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