Design and production of magnetic and hybrid components, pressure sensors.
Thick-film hybrids; Hybrid modules on ceramic substrates; Coating services; Laser welding / cutting; Reflow services; Production services for component / chip carrier manufacturing, miscellaneous; Bonding of dies on PCBs; Flip chip insertion; Assembly production; Plug-in connectors for press-fit applications; PCB connectors; Battery plug-in connectors; E-mobility connectors; Press-fit connectors; HTCC (High-temperature Co-fired Ceramic); Al2O3 substrates; AlN substrates; Ceramic PCBs, miscellaneous; Common mode chokes; Aircore coils; Power transformers; Plastic-bonded hard-ferrite magnets; Plastic-bonded neodymium iron boron magnets; Pressure (gauge, absolute, differential)
Applications: Automation (A); Electro-Mobility (E); Power Electronics and Energy Technology (PE)
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