JTA Equipment Technology
Automatic tape & dry film lamination, metal lift-off & SiC CMP/wafer grind
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USA/European distributor for the Takatori back-end packaging and SiC processing solutions, tape and dry film lamination, solvent free metal lift off. Our Automated systems give improved uptime and lower consumable costs for 24/7 manufacturing operations. Recent enhancements in “tapeless detape” lowers COO and the 5-roll “auto tape-change” feature reduces resupply time and gives 36 hours of non stop production capability. Automated dry-film resist application is available in vacuum and atmospheric processes for conformal or tenting lamination up to 300mm wafer diameter. The SiC-focused grinder supports substrate manufacturing and wafer thinning and the auto wheel-change and auto-dressing features significantly improve tool availability. Gigamat provides SiC CMP and wafer sorters.
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ABOUT
- Headquarters in Newcastle NE6 1TW, Great Britain
- Founded in
- Number oof employees:
- Approx Revenue:
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Contact
- Address: 34 St. Peters Wharf, Newcastle NE6 1TW, Great Britain
- Company Contact: 4.47906E+11 peterthompson@jta- com
- Contact Person: Mr. Dr Peter Thompson Technical Director
- Contact Person Email : peterthompson@jta- com
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Applications
Automotive (AE); Power Electronics and Energy Technology (PE)
Products & Services: Equipment, Nanotechnology Tools; Backgrind; Slicing; Lapping; Polishing Equipment; Wafer Mount; Taping Equipment; Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment