HongRuiXing (Hubei) Electronics
HOREXS is experienced IC substrate manufacturer.
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Horexs is a professional semiconductor packaging substrate manufacturer. It's Products are widely used in SiP/CSP/FCCSP/FCBGA/MEMS/Memory(eMMC/DDR/MicroSD/USB/UDP)/RF Module package.As well the other microelectronics Fingerprint and camera electronics etc.HOREXS produce IC substrate since in 2009, has more than 15 years experience in package substrate production, With HOREXS technology(mSAP/Substrative/RCC), We can help customers reduce their substrate purchasing cost at the high quality and reliability guarantee.Support:2-10 layer(with blind/bury hole);Coreless;FCBGA, FCCSP, Memory(MicroSD, eMMC/DDR series/LPDDR), CSP, FCBOC, SiP, MEMS package substrate, as well as Sensors, Microelectronics such as fingerprint/Camera assembly PCB.Welcome explore with AKEN for business cooperation.
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ABOUT
- Headquarters in Huangshi, China
- Founded in
- Number oof employees:
- Approx Revenue:
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Contact
- Address: Special No. 2, Baoshan Rd., Daye City, 435000 Huangshi, China
- Company Contact: 8.67143E+11 akenzhang@horexspcb.com
- Contact Person:
- Contact Person Email :
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Applications
5G/6G (G); Internet of Things (IoT) (I)
Products & Services: PCBs; Packaging materials; Ultrathin ML (100 µm / layer); Ultrafine-line circuitry (< 50 µm)