DISCO HI-TEC EUROPE
Total solutions for dicing, grinding and polishing of semiconductor wafers
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DISCO is a leading solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We develop and manufacture precision dicing, grinding and polishing machines as well as dicing blades and grinding/polishing wheels. Ablation laser and stealth laser dicing saws, plasma processing and tape mounting equipment are also available from us. Our unique advantage is that we can provide you with not only machines and consumables, but also the total process solutions based on our wide range of application experiences. Dicing-Grinding Service and Camtek optical inspection service (AOI) are available in our cleanrooms in Munich.
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ABOUT
- Headquarters in Kirchheim bei München, Germany
- Founded in
- Number oof employees:
- Approx Revenue:
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Contact
- Address: Liebigstrasse 8, 85551 Kirchheim bei München, Germany
- Company Contact: 498990903 contactsales@discoeurope.com
- Contact Person:
- Contact Person Email :
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Applications
Automation (A); Power Electronics and Energy Technology (PE)
Products & Services: Cutting; Drilling; Laser ablation; Beveling Equipment; Backgrind; Slicing; Lapping; Polishing Equipment; Dicing; Sawing; Scribing; Separation Equipment; Wafer Mount; Taping Equipment