About Applied Microengineering (AML)

AML designs and manufactures Wafer Bonding systems with in-situ alignment capabilities.The AWB systems offer outstanding flexibility, enabling a wide range of bonding techniques to be carried out and are ideally-suited to process development.The systems feature an optical wafer-to-wafer alignment system as standard, with the capability of 1µm accuracy. All bonding process steps can be carried out sequentially within the bonding chamber, without exposure to air between stages: Wafers are held in separation, up to 30mm apart operation under vacuum or controlled atmosphere independent heating of upper/lower wafers, up to 560°C in-situ radical-activation or chemical treatment of bonding surfaces in-situ alignment, immediately prior to bonding bonding, with contact forces up to 40kN