Provides optoelectronic module assembly and advanced packaging solutions.
Multi-chip module hybrids, miscellaneous; Component insertion; Bonding of dies on PCBs; Design; Process development; Miniaturization development; Single-chip packaging (SCP); MEMS packaging technology and services, miscellaneous; MEMS sensors, miscellaneous; Optical MEMS, miscellaneous; Mounting, housing and bonding technology; Microsensor systems, miscellaneous
Applications: Automation (A); Healthcare/Wearables (HW)
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