Manufactures dicing saws and equipment for semiconductor wafer processing.

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ADT specializes in the development and manufacturing of dicing saws, blades and peripherals for a wide variety of applications: silicon- based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT is a one stop shop with end-to-end research, development and production held in the company’s advanced ISO 9001:2015 certified facilities.ADT’s dicing saws’ line offer a variety of capabilities and configurations as well as unique solutions for special materials and applications. ADT’s dicing diamond blades range includes resin blades, sintered blades, nickel blades and hub blades. ADT’s blades are the perfect dicing solution for various materials and substrates, such as: QFN & BGA packages, ceramics, glass and more.