Micron Technology's USD 2.75 billion assembly, test, mark, and packaging facility in Sanand, Gujarat is now in full commercial production, packaging and testing DRAM and NAND flash memory chips for mobile, automotive, and data centre markets, making it India's most advanced semiconductor facility and a model for the OSAT and packaging investments being catalysed under India's Semicon 2.0 programme.
Semicon Hunt -> manufacturing -> Micron Technology
2026-09-01
Micron Technology's assembly, test, mark, and packaging facility in Sanand, Gujarat, is now in full commercial production, marking a significant milestone for India's semiconductor manufacturing programme. The facility, which represents a USD 2.75 billion investment and was inaugurated by Prime Minister Modi in February 2026, packages and tests DRAM and NAND flash memory chips for Micron's global product portfolio, serving customers in the mobile, automotive, and data centre segments. Micron Sanand is the most technologically advanced semiconductor manufacturing facility currently operating in India and has become the benchmark against which other OSAT and packaging investments in the country are evaluated.
The Sanand facility handles the back-end of Micron's semiconductor manufacturing process, taking wafers fabricated at Micron's US, Japan, and Taiwan fabs and converting them into finished packaged chips ready for end-customer use. Operations at the facility include wafer singulation, die attach, wire bonding and flip-chip interconnect, moulding and encapsulation, ball grid array attachment, final testing and burn-in, marking, and tape-and-reel or tray packaging for volume shipment. The facility is equipped to handle multiple generations of DRAM and NAND flash packaging formats, including DDR5 DRAM modules for high-performance computing and LP5 DRAM for mobile applications, as well as 3D NAND flash packages for enterprise SSD and consumer storage products.
The Micron Sanand facility employs over 2,500 people in direct roles, the majority of whom are engineers and technicians recruited from Gujarat and neighbouring states. The company has invested in structured training programmes in partnership with local engineering colleges and the Gujarat government's skill development infrastructure, creating a semiconductor operations workforce from a near-zero local base. The facility's employment impact extends to an estimated 10,000 indirect jobs in the surrounding supplier and services ecosystem, including chemical supply logistics, precision parts manufacturing, facilities management, and transportation. Micron's Sanand experience is being studied by other potential OSAT investors as a proof-of-concept for building a skilled semiconductor operations workforce in India within a relatively short timeframe.
Micron Sanand operates alongside CG Power's OSAT facility in Sanand and Kaynes Semicon's packaging plant in Mysuru, together forming the nucleus of India's emerging assembly, testing, and packaging cluster. The three facilities together give India a meaningful OSAT footprint that is already serving global semiconductor supply chains, demonstrating that India can meet the operational standards required for high-volume commercial semiconductor packaging. This operational track record is crucial for Semicon 2.0's goal of attracting the next wave of OSAT investment from global memory manufacturers, logic chip companies, and automotive semiconductor suppliers seeking to diversify their back-end manufacturing away from concentration in Taiwan, Malaysia, and Thailand.
While ATMP facilities do not manufacture chips from raw silicon, they perform the critical final manufacturing steps that determine a packaged chip's yield, reliability, and performance, and they count as domestic value addition under India's semiconductor self-sufficiency metrics. Micron Sanand's commercial-scale operation means that a significant volume of DRAM and NAND chips consumed in India can now be classified as domestically processed, contributing to ISM 2.0's 75 percent self-sufficiency target for 2030. As the Dholera fab begins wafer production later in 2026 and more OSAT facilities come online under Semicon 2.0, the collective contribution of India's semiconductor manufacturing base to domestic self-sufficiency is expected to grow substantially year on year.
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