Intel has signed a tripartite MoU with 3D Glass Solutions and the Odisha government to establish a $3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region. The facility will produce glass-core substrates, HDI substrates, and 3DHI modules for AI, defence, and high-performance computing markets, generating 1,800 high-skill jobs over five to six years. It is India's largest advanced packaging investment after the Tata-PSMC fab.
Semicon Hunt -> partnership -> Intel
2026-05-29
Intel Corporation has signed a tripartite memorandum of understanding with 3D Glass Solutions (3DGS) and the Odisha government to establish a $3.3 billion advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region — the largest high-technology manufacturing investment in India after the $11 billion Tata-PSMC fab in Dholera. The MoU was signed in New Delhi on May 29, 2026 in the presence of Odisha Chief Secretary Anu Garg and Intel CEO Lip-Bu Tan.
The facility will focus on advanced packaging glass-core substrates, high-density interconnect (HDI) substrates, and 3D Heterogeneous Integration (3DHI) modules. Annual planned capacity includes 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. Products will serve defence, AI, high-performance computing, radio-frequency, automotive, photonics, and co-packaged optics markets.
Intel is a pioneer in glass-core substrate technology and will contribute technology know-how and process expertise. Naga Chandrasekaran, EVP and GM of Intel Foundry, said the project would 'accelerate the commercialisation of next-generation advanced packaging solutions globally.' Babu Mandava, CEO of 3DGS, added that the facility has the potential to establish India as a key global hub for advanced glass substrates — supporting AI, high-performance computing, and next-generation electronics.
The project is expected to generate 1,800 direct high-skill jobs over five to six years and catalyse upstream investment in speciality chemicals, advanced materials, capital equipment, and glass substrates. Odisha Chief Minister Mohan Charan Majhi said the initiative aims to position Odisha as a globally competitive destination for AI infrastructure and digital transformation. The MoU builds on 3DGS's earlier Cabinet approval under ISM in August 2025 for the Bhubaneswar unit, dramatically scaling the investment and adding Intel's global technology backing.
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