Indium Corporation Deepens India Bet on Chip Packaging

Indium Corporation Bets on India's Packaging Boom

As India's semiconductor manufacturing push moves from announcements toward pilot production, suppliers of the materials that hold chips together are positioning themselves early. Indium Corporation, a global supplier of solder pastes, alloys and fluxes, already operates a factory in Chennai producing high-end solder paste, and the company says it sees India as both a demand market and a future innovation hub.

From Logistics to Long-Term Strategy

'We are proud of our factory in Chennai, and we see the electronics industry, both printed circuit board assembly and semiconductor packaging, having a very bright future,' said Ross Berntson, CEO of Indium Corporation. He explained that the original driver for a local footprint was logistics, since solder paste is perishable, but the company now views India as a long-term market for both demand and innovation.

Durafuse LT Finds New Applications

One product gaining traction is Indium's Durafuse LT solder, initially developed for low-temperature assembly. According to Berntson, the material 'is now finding applications in AI packaging and telecom', and the company also sees strong opportunities emerging in e-mobility and thermal management as India's electronics manufacturing base expands.

Building Toward an R&D Presence

Beyond manufacturing, Indium is looking to expand its India operations into research and development. 'In the future, I could see us having an R&D team here,' Berntson said, pointing to the willingness of Indian customers to collaborate and iterate on new materials as a key advantage. The company is also partnering with universities in India to build technical know-how ahead of demand from upcoming OSAT and fab facilities.

A Wider Materials Supply Race

Indium is not alone in eyeing the opportunity. Other global materials suppliers, including bonding wire specialists, are also expanding their India footprints, betting that demand for chip-grade wires, pastes and adhesives will surge once India's semiconductor packaging and fabrication plants ramp toward full production between 2026 and 2030.

Why It Matters

India currently relies heavily on imported chip-grade materials for advanced packaging, even though it has a strong base of suppliers for general electronics assembly. Early moves by companies like Indium Corporation signal growing confidence that India's semiconductor ecosystem will generate sustained demand for these specialty materials, and that being established locally now could pay off as fabs and OSAT facilities reach commercial scale.

Looking Ahead

For Indium Corporation, the calculus is straightforward: as India's fabs and OSAT lines move from groundbreaking ceremonies to commissioning and pilot runs over the next few years, demand for chip-grade solder pastes, alloys and fluxes is expected to rise sharply. By establishing manufacturing, customer relationships and university partnerships now, the company is positioning itself to be a default supplier when India's packaging plants reach commercial volumes, rather than entering the market only after demand has already materialized.