Cyient Semiconductors Scales ASIC Turnkey Design Wins Across Verticals

Cyient Semiconductors Positions India as a Custom ASIC Design Destination

Cyient Semiconductors, the dedicated semiconductor business unit within Hyderabad-headquartered engineering services group Cyient, has reported growing traction for its ASIC turnkey design offering across multiple industry verticals. The turnkey model covers the full chip development lifecycle from initial customer specification and architectural exploration through RTL design, physical implementation, sign-off, tape-out coordination with a foundry partner, and post-silicon bring-up and validation. This end-to-end service is designed for companies that have a need for custom silicon but do not possess an internal chip design organisation or prefer not to build one for a specific programme. Cyient is positioning this capability as a means to make ASIC development accessible to mid-sized industrial, aerospace, and medical technology companies that would previously have relied on programmable logic alternatives.

Target Verticals and Recent Design Wins

Aerospace and defence applications represent Cyient's strongest segment for ASIC work, where the combination of reliability requirements, radiation tolerance specifications, and export control considerations creates demand for custom silicon that off-the-shelf components cannot satisfy. Recent design wins in this segment involve signal processing ASICs for airborne radar systems and power management chips for satellite payload electronics. In industrial automation, Cyient has completed programmes for motor control ASICs used in robotics joints and pneumatic valve controller chips. Medical electronics programmes include low-power analogue front-end ASICs for wearable biosensors and signal acquisition chips for portable diagnostic devices, where the integration of sensing, processing, and communication in a single custom chip enables device form factors impossible with discrete component designs.

Technical Capabilities and Process Node Coverage

Cyient Semiconductors maintains design capability across a range of process nodes from mature nodes such as 180nm and 130nm through to more advanced nodes including 28nm and 16nm, depending on the power, performance, and area requirements of each programme. The division employs engineers specialised in digital RTL design, analogue and mixed-signal circuit design, physical design and layout, and verification including formal methods and emulation. Cyient has qualified flows with multiple foundry partners including TSMC, GlobalFoundries, and United Microelectronics Corporation, giving customers flexibility in foundry selection based on availability and programme requirements. The company also provides DFT and packaging coordination services to deliver a complete tape-out package.

Growth Targets and Market Context

Cyient has indicated a target of ten new ASIC programme starts in fiscal year 2027, roughly doubling the programme intake from the prior year. This growth is supported by broader trends including the increasing cost of general-purpose processor solutions for dedicated workloads, stricter data localisation requirements pushing some companies toward custom hardware for edge compute applications, and the growing recognition among mid-sized industrial companies that custom silicon can deliver sustainable competitive advantages in product performance and cost. Cyient's positioning as an Indian company with domain expertise in regulated verticals gives it credibility with customers in those sectors and competitive advantages over generic low-cost chip design service providers.