Broadcom Expands India Design Centres for Networking and AI Chip Work

Broadcom Deepens India Engineering Commitment with 1,000-Plus New Hires

Broadcom, one of the world's largest semiconductor companies by revenue and a dominant force in networking, storage, and broadband chips, is executing a significant expansion of its India-based engineering operations. The company's design centres in Bengaluru, Pune, and Hyderabad collectively employ thousands of engineers and contribute to chip designs across Broadcom's core product families. The expansion, which involves hiring over 1,000 additional engineers across these three locations in 2026, reflects Broadcom's strategy of concentrating a large share of its global design capacity in India, where the supply of highly qualified semiconductor engineers is deep and growing.

Product Families and Design Programmes in India

Broadcom's India teams are responsible for design work on several of the company's highest-volume and most technically complex product lines. Ethernet networking silicon, which is the core of Broadcom's Tomahawk and Trident switch ASIC families used in hyperscale data centre switching infrastructure, has significant design contribution from Bengaluru. PCIe switches and bridges, used to interconnect CPUs, GPUs, and storage devices in AI training servers, are another area of India-based ownership. The custom ASIC design programme, through which Broadcom designs fully bespoke chips for hyperscale customers including Google, Meta, and Microsoft, also involves India engineering teams in verification, physical design, and post-silicon validation roles. The expansion adds headcount across all three programme areas, with the AI-related custom ASIC programme growing fastest given hyperscaler demand for specialised silicon.

City Specialisations and Hiring Strategy

Broadcom's three India locations each have distinct specialisations that have evolved over years of operation. Bengaluru focuses on front-end design and architecture for networking and storage chips, drawing on the city's large pool of digital design engineers with experience at other semiconductor companies. Pune contributes physical design and place-and-route work, leveraging a concentration of physical design specialists who have supported multiple generations of Broadcom chip layouts. Hyderabad handles a mix of verification, firmware development, and hardware-software co-design work, particularly for complex SoC products where the interaction between hardware and software layers requires close collaboration across disciplines. The hiring expansion adds to all three locations, with Hyderabad's firmware and software engineering headcount growing fastest to support the AI chip programmes where software stack development is as critical as hardware design.

India's Strategic Importance to Broadcom's Long-Term Plan

Broadcom's India expansion is part of a deliberate strategy to make India the company's primary non-US engineering hub, reducing concentration of design capability in the United States and providing a time-zone-complementary engineering base for global programme execution. The target of 6,000 India-based engineers by 2028 represents a doubling of the company's India footprint over roughly five years and would make Broadcom India one of the ten largest semiconductor engineering teams in the country by headcount. This scale gives Broadcom the ability to assign full programme ownership to India teams rather than relying on them for supporting roles, which improves operational efficiency and deepens the career development opportunities available to Indian engineers, making Broadcom a more competitive employer in India's intensely competitive semiconductor talent market.