US-based 3D Glass Solutions will build a vertically integrated advanced packaging facility in Odisha's Info Valley, backed by an approved investment of about $2.32 billion under the India Semiconductor Mission. The plant will produce glass interposers, silicon bridges and 3D heterogeneous integration modules, with annual capacity for 69,600 substrates, 50 million assembled units and 13,200 3DHI modules, targeting defense, AI, high-performance computing and co-packaged optics markets.
Semicon Hunt -> manufacturing -> 3D Glass Solutions
2026-06-11
US-based 3D Glass Solutions (3DGS) is set to establish a vertically integrated advanced packaging and embedded glass substrate facility at Info Valley, Bhubaneswar, Odisha, after India's Union Cabinet approved the project with an investment of about $2.32 billion. The plant is one of four new semiconductor manufacturing units cleared under the India Semiconductor Mission, alongside projects from SiCSem, Continental Device India and ASIP Technologies.
The facility is designed to manufacture glass interposers, silicon bridges and 3D heterogeneous integration (3DHI) modules, with planned annual capacity of 69,600 substrates, 50 million assembled units and 13,200 3DHI modules. According to government briefings, target markets span defense, high-performance computing, AI accelerators, RF systems, automotive electronics, photonics and co-packaged optics.
VLSI Society of India president Satya Gupta described the project as technically distinct from the other ISM-backed manufacturing units. 'Most packaging today uses organic substrates, but glass substrates can carry a wider range of signals, including optical, which makes them important for high-performance computing, AI, and data centers as silicon scaling becomes harder,' he said. 3DGS uses its patented APEX glass platform to enable ultra-high-density interconnects for chiplet-based designs.
India's Minister for Electronics and IT, Ashwini Vaishnaw, told the Union Cabinet that several major companies, including Intel and Lockheed Martin, are expected to invest in the Odisha facility alongside private equity and venture capital firms. The involvement of established aerospace and semiconductor names signals confidence in glass-substrate packaging as a growth segment tied closely to AI infrastructure buildout.
The 3DGS plant joins SiCSem's silicon carbide fab in the same Info Valley industrial area, part of Odisha's push to position itself as a compound semiconductor and advanced packaging cluster. The state raised its fab subsidy to 50 percent, fast-tracked land allocation and environmental clearances, and committed to power and water supply guarantees to attract these capital-intensive projects.
The 3DGS facility adds a high-value, technologically differentiated layer to India's semiconductor manufacturing buildout, complementing fab and OSAT investments elsewhere in the country. As AI data center demand accelerates the shift toward advanced packaging architectures such as glass interposers and 3D heterogeneous integration, the Odisha plant positions India to participate directly in one of the fastest-growing segments of the global semiconductor supply chain.
Beyond manufacturing output, the project is expected to support skilled jobs in glass processing, precision lithography and advanced metrology, while drawing engineering talent from India's expanding pool of materials science and electronics graduates, reinforcing Odisha's emergence as a compound semiconductor and advanced packaging hub.
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